Many airborne applications require the use of conduction cooled hardware to provide for appropriate thermal management of a circuit board in the absence of cooling air. Acme Embedded Solutions is experienced in a variety of conduction cooling techniques that can be cost effectively employed to either ensure that a new design will operate reliably with zero air flow, or that an existing design can be converted to operate in a conduction cooled operating environment.

Conduction cooling of an existing design through the use of elastomers or “Jelly Bags” has been used with limited success in selected applications. In most cases, the successful qualification of a conduction cooled design will be driven by a relayout of the printed circuit board, to allow aggressive cooling treatments to be employed on a component by component basis.